This document deals with the shielding of PROFIBUS/PROFINET networks and with equipotential bonding in the corresponding plants in non-hazardous areas. The document describes an optimized structure for process automation systems intended to reduce the effects of EMI and disturbances by using equipotential bonding systems. In a tiered approach, the readers are first made familiar with the technical basics of electromagnetic compatibility (EMC), equipotential bonding and shielding. In the later sections, six recommendations for action are developed by using a plant example.
November 30, 2017|