Tool ID and I/O in One

Tool ID and I/O in One
Collect I/O data as well as provide die identification information all in one simple-to-implement package.

In a metalforming and stamping facility, there is usually the need to change out dies and tooling in the press on a regular basis. Tracking the die ID is becoming an important piece of information in every press shop. Many die ID programs implement a simple input-based system that has a code of sorts built into a high density pin connector. This 24-pin connector also collects a small set of I/O data on the press. This solution has a high initial cost due to the 24-wire cable and the special wiring configurations that need to be made. Then once implemented, the pin connectors inside get damaged or bent causing downtime to repair the connectors. Damage to these connectors from die change or from daily use can cause significant downtime. Balluff offers a rugged solution for quick die changes that collect I/O data as well as provide die identification information all in one simple-to-implement package over a Profinet or Profibus network.Balluff Tool ID and I/O in one

  • Decreases wiring time and mistakes by using standard wiring for all dies
  • Eliminates pin damage by using a non-contact connector
  • Eliminates die rework due to operator forgetting to unplug connector
  • Increases data reliability using Industrial RFID for die identification

Basic Solution: An I/O hub for identification can easily be integrated into an existing Profinet or Profibus network on the press using an IO-Link expansion block. IO-Link is an open standard that is adopted by many major controller manufacturers and allows for smart devices to communicate with the controller and collect more information about the process than just I/O. IO-Link expansion blocks can communicate with up to 4 IO-Link devices simultaneously. The I/O hubs are available with diagnostics, two bytes of ID data, and up to 16 inputs or outputs. This allows for greater flexibility right on the die for any die protection program in effect in the facility.

Enhanced Solution: In addition to replacing high density connectors and cables, there can be issues with operators forgetting to disconnect the wired connectors. This requires costly die repair due to cable damage of the die protection sensors and devices. To alleviate this problem, a non-contact connector solution can be implemented that will power the sensors in use on the die as well as collect the I/O and ID data. The non-contact connector transmits power and data across a small air gap and communicates back to the IO-Link expansion module, which in turn communicates over Profinet or Profibus back to the controller. This removes any need for the operator to remember to disconnect the homerun cable when changing out a die.

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About Balluff:
Balluff Inc., the U.S. subsidiary of Balluff GmbH, Neuhausen, Germany, is a leading manufacturer of a wide range of inductive, photoelectric, vision, capacitive and magnetic sensors as well as linear position transducers, RFID systems, and networking products. Balluff products for OEM and factory floor solutions are used to control, regulate, automate, assemble, position, and monitor manufacturing, assembly, and packaging sequences for industries including: metalworking, automotive, plastics, material handling, wood processing, aerospace, alternative energy, medical, electrical, and electronics.