Balluff introduces distributed modular I/O for PROFINET

Balluff introduces distributed modular I/O for PROFINET


Balluff’s new generation of distributed modular I/O can be used in a cost effective way to replace standard slice I/O and distributed I/O solutions. Offering IP67 protection and industry standard connectors, many types of control data can be collected. Using standard 3-conductor cables, up to 4 slave devices can be connected to each master block, which communicates over the PROFINET network to the controller.


In lieu of a backplane, each I/O device is connected to an industry-standard M12 port, creating an IP67 connection. With the ability to be installed within a 20 meter radius from the master device, slave devices can be easily distributed across the machine. Utilizing a widely accepted and open point-to-point technology, IO-Link, a distributed modular I/O system is fieldbus independent, is easily configured and is vendor neutral.


Types of distributed modular I/O slave devices:
– Discrete Inputs & Outputs
– Analog Input & Output Channels
– Valve Manifold Control
– Industrial RFID Processors & Heads
– Specialty sensors for measurement, position, or color detection.


Advantages of distributed modular I/O systems include:
– Simplified controls quotation process by utilizing fieldbus neutral I/O devices.
– Reduction in the total cost per point by simplifying the cabinet cost and the assembly labor involved.
– Maximized spare I/O potential by leaving a flexible IO-Link port free for any type of device: discrete, analog, etc.
– Detailed diagnostic information can be collected from the devices easily and in a standard format.
– Flexibility to drive recipe changes directly from the PLC to the devices without frustrating manuals or pushbuttons.


These industrial master blocks support daisy-chain connections with a built-in switch; support Fast Start Up (FSU) as well as the Link Layer Discovery Protocol (LLDP) for easy setup right out of the box. Master devices have easy-to-use, lockable pushbutton displays for quick setup and provide webpages for configuration or diagnostics purposes.


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About Balluff:

Balluff Inc., the U.S. subsidiary of Balluff GmbH, Neuhausen, Germany, is a leading manufacturer of a wide range of inductive, photoelectric, vision, capacitive and magnetic sensors as well as linear position transducers, RFID systems, and networking products. Balluff products for OEM and factory floor solutions are used to control, regulate, automate, assemble, position, and monitor manufacturing, assembly, and packaging sequences for industries including: metalworking, automotive, plastics, material handling, wood processing, aerospace, alternative energy, medical, electrical, and electronics.